Description

Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform

US Plug, Compatible with iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Pro, 12 Pro Max, and 12 Mini

Product Features:

1. Unique Edge-Sealing Insulation Design:
   Ensures rapid tin melting in the middle layer while protecting the motherboard.

2. Efficient and Non-Destructive Operation:
   Facilitates seamless layering and bonding without damaging delicate components.

3. Double-Layer Motherboard Compatibility:
   Specifically designed for layering and bonding tasks on double-layer iPhone motherboards.

4. Host-Free, Air Gun-Free, Soldering Iron-Free:
   Achieves accurate layering and bonding within three minutes, eliminating the need for additional tools while maintaining motherboard integrity.

5. Plug-and-Play Design:
   Supports easy assembly and disassembly, streamlining repair workflows and saving valuable time.

6. Preheating Temperature:
   Set at an optimal range of 180-190C, ensuring safe and efficient preheating for desoldering and bonding tasks.

Specifications:

• Compatibility:
  • Apple iPhone X, XS, XS Max
  • iPhone 11, 11 Pro, 11 Pro Max
  • iPhone 12, 12 Pro, 12 Pro Max, 12 Mini
• Package Weight: 0.32 kg (0.71 lb)
• Package Dimensions: 15 cm x 12 cm x 6 cm (5.91 in x 4.72 in x 2.36 in)
• Carton Details:
  • Quantity per Carton: 45 units
  • Carton Weight: 14.04 kg (30.95 lb)
  • Carton Size: 47 cm x 38 cm x 32 cm (18.5 in x 14.96 in x 12.6 in)

Applications:

• Ideal for iPhone motherboard layering, bonding, and soldering tasks.
• Prevents tin-blasting and protects sensitive components during repairs.