Description

Reflow Soldering Heating Platform

Features:

1. Versatile Reflow Soldering Modes:

   • Offers 5 professional modes for specific tasks like degumming, layering, lamination, tin planting, and welding.
   • Includes 3 common operation modes with memory functionality for quick and easy use.

2. Curve Heating for Mobile Motherboards:
   Designed especially for original mobile phone motherboard soldering with precise curve heating for safe desoldering and reflow operations.

3. Advanced Heating Technology:

   • Upgraded MCH ceramic double heating element replaces traditional single elements.
   • Delivers faster heating, uniform temperature distribution, and enhanced performance stability.

4. Temperature Memory:

   • 3 commonly used memory temperatures can be recorded manually or automatically, even retaining settings when powered off.

5. Efficient Heat Dissipation:

   • Equipped with turbofan blades and a strong wind cooling system.
   • Automatically adjusts fan speed based on the temperature for optimal heat management.

6. Real-Time Monitoring:

   • Tracks temperature changes and displays reflow soldering temperature curve data.
   • Real-time detection of both heating and cooling temperatures without switching interfaces.

7. Broad Compatibility:
   Suitable for a wide range of iPhone models, including:

   • iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12 Mini, 12, 12 Pro, 12 Pro Max, 13 Mini, 13, 13 Pro, 13 Pro Max.

Specifications:

• Package Weight: 1.22 kg / 2.69 lb
• Package Dimensions: 20 cm x 18 cm x 8 cm (7.87 in x 7.09 in x 3.15 in)
• Carton Details:
  • 16 units per carton.
  • Carton Weight: 20.40 kg / 44.97 lb.
  • Carton Dimensions: 42 cm x 38 cm x 34 cm (16.54 in x 14.96 in x 13.39 in).